1 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com smd ? b EAST16083BA1 features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapor phase reflow solder process. ? mono-color type. ? pb-free. ? the product itself will remain wi thin rohs compliant version. ? compliance with eu reach. ? compliance halogen free .(br <900 ppm ,cl <900 ppm , br+cl < 1500 ppm). description ? the smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. applications ? backlighting in dashboard and switch. ? telecommunication: indicator and backlighting in telephone and fax. ? flat backlight for lcd, switch and symbol. ? general use.
datasheet smd ? b EAST16083BA1 2 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com device selection guide chip materials emitted color resin color ingan blue water clear absolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 5 v forward current i f 25 ma peak forward current (duty 1/10 @1khz) i fp 100 ma power dissipation pd 95 mw electrostatic discharge esd hbm 150 v operating temperature t opr -40 ~ +85 storage temperature tstg -40 ~ +90 soldering temperature tsol reflow soldering : 260 for 10 sec. hand soldering : 350 for 3 sec.
datasheet smd ? b EAST16083BA1 3 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com electro-optical char acteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 11.5 ----- 28.5 mcd i f =5ma viewing angle 2 1/2 ----- 120 ----- deg peak wavelength p ----- 468 ----- nm dominant wavelength d 465 ----- 475 nm spectrum radiation bandwidth ----- 35 ----- nm forward voltage v f 2.7 ---- 3.2 v reverse current i r ----- ----- 50 a v r =5v note: 1.tolerance of luminous intensity: 11% 2.tolerance of dominant wavelength 1nm 3. tolerance of forward voltage: 0.05v
datasheet smd ? b EAST16083BA1 4 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com bin range of luminous intensity bin code min. max. unit condition l1 11.5 14.5 mcd i f =5ma l2 14.5 18.0 m1 18.0 22.5 m2 22.5 28.5 bin range of dom. wavelength bin code min. max. unit condition x 465 470 nm i f =5ma y 470 475 bin range of forward voltage bin code min. max. unit condition 29 2.70 2.80 v i f =5ma 30 2.80 2.90 31 2.90 3.00 32 3.00 3.10 33 3.10 3.20 note: 1.tolerance of luminous intensity: 11% 2.tolerance of dominant wavelength 1nm 3. tolerance of forward voltage: 0.05v
datasheet smd ? b EAST16083BA1 5 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com typical electro-optical characteristics curves 25 0 50 75 100 ta=25c forward voltage v (v) relative luminous intensity (%) -60 forward current derating curve ambient temperature ta (c) forward current f i (ma) 1 10 -20 -40 0 20 60 40 100 80 relative luminous intensity (%) 100 1000 forward current wavelength (nm) luminous intensity vs. ambient temperature i (ma) f spectrum distribution forward voltage f ta=25c forward current vs. 10 relative luminous intensity (%) 1 10 100 forward current i (ma) 10 10 f ta=25c luminous intensity vs. forward current 30 20 ta=25c 10 0 radiation diagram 40 60 50 90 80 0.6 70 0.2 0.1 0.5 0.3 0.4 1.0 0.8 0.9 0.7 ambient temperature ta (c) 400 550 450 500 600 2.6 0 10 25 20 40 30 50 4.2 3.4 3.0 3.8 4.5 1000 1 2 0 10 0 20 30 25 40 50 40 20 60 100 85
datasheet smd ? b EAST16083BA1 6 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com package dimension recommended solder pad suggested pad dimension is just for reference only. please modify the pad dimension based on individual need. note: tolerances unless mentioned 0.1mm. unit = mm
datasheet smd ? b EAST16083BA1 7 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com label explanation ? cpn: customer?s product number ? p/n: product number ? qty: packing quantity ? cat: luminous intensity rank ? hue: chromaticity coordinates & dom. wavelength rank ? ref: forward voltage rank ? lot no: lot number reel dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm
datasheet smd ? b EAST16083BA1 8 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com carrier tape dimensions: loade d quantity 3000 pcs per reel note: the tolerances unless mentioned is 0.1mm ,unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag
datasheet smd ? b EAST16083BA1 9 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com precautions for use 1. over-current-proof customer must apply resistors for protection, ot herwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 or less and 90%rh or less. 2.3 after opening the package: the led's floor life is 1 year under 30 or less and 60% rh or less. if unused leds remain, it should be stored in moisture proof packages. 2.4 if the moisture absorbent material (silica gel ) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile pre-heating 150~200c 60~120sec. above 217c 60~150sec. 260c max. 10sec. max. 6c/sec.max. above255c 30sec.max. 3c/sec.max. 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more inte rvals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed befor ehand whether the characteristics of the leds will or will not be damaged by repairing.
datasheet smd ? b EAST16083BA1 10 copyright ? 2010, everlight americas inc. all rights reserved. release date : 05-jul-2011. issue no: 1 rev.1 www.everlightamericas.com application restrictions high reliability applications such as military/aer ospace, automotive safety/security systems, and medical equipment may require different produc t. if you have any concerns, please contact everlight americas before using this product in your application. th is specification guarantees the quality and performance of the product as an individual component. do not use this product beyond the specification described in this document.
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